1. Present status and prospect of Si wafers for ultra large scale integration;Tsuya;Japan Journal of Applied Physics,2004
2. Mike Seacrist, Silicon starting materials for sub-65nm technology nodes, in: 9th International Symposium on Wafer Cleaning and Surface Preparation, June 8–9, 2005, Boise, Idaho, USA.
3. International Technology Roadmap for Semiconductors 2009 Edition, Front End Processes, 〈http://www.itrs.net〉.
4. Recent advances in machining of silicon wafers for semiconductor applications;Sreejith;International Journal of Advanced Manufacturing Technology,2001
5. A study on surface grinding of 300mm silicon wafers;Pei;International Journal of Machine Tools and Manufacture,2002