Manufacturing profile-free copper foil using laser shock flattening

Author:

Haifeng Yang,Fei Xiong,Yan Wang,Le Jia,Hao Liu,Jingbin Hao

Funder

Fundamental Research Funds for the Central Universities

Priority Academic Program Development of Jiangsu Higher Education Institutions [PAPD]

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference37 articles.

1. Influence of low oxygen content on the recrystallization behavior of rolled copper foil;Zhao;Oxid Met,2018

2. Laser drilling of copper foils for electronics applications;Moorhouse;IEEE Trans. Compon. Packag. Technol.,2007

3. Profile-free copper foil for high-density packaging substrates and high-frequency applications;Ogawa;Electron. Compon. C,2005

4. Evaluating PCB plated through holes for 5G applications;Coonrod;Microw. J.,2018

5. E-band beam-steerable and scalable phased antenna array for 5G access point;Islam;Int. J. Antenn. Propag.,2018

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