Characteristics of Cu films prepared using a magnetron sputter type negative ion source (MSNIS)
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference20 articles.
1. In situ x-ray microscopic observation of the electromigration in passivated Cu interconnects
2. On the unusual electromigration behavior of copper interconnects
3. Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life‐Test Method
4. Characterization of diamond-like carbon (DLC) films deposited by a magnetron-sputter-type negative ion source (MSNIS)
5. N. Paik, Diamond Relat. Mat., to be published. doi:10.1016/j.diamond.2004.11.005
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