Calibration correction of ultra low energy SIMS profiles based on MEIS analyses for arsenic shallow implants in silicon
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference6 articles.
1. Comparison between the SIMS and MEIS techniques for the characterization of ultra shallow arsenic implants
2. Arsenic shallow depth profiling: accurate quantification in SiO2/Si stack
3. Advanced secondary ion mass spectroscopy quantification in the first few nanometer of B, P, and As ultrashallow implants
4. Characterization by medium energy ion scattering of damage and dopant profiles produced by ultrashallow B and As implants into Si at different temperatures
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1. Complementary characterization method of 3D arsenic doping by using medium energy ion scattering;Journal of Physics Communications;2021-01-01
2. Characterization of arsenic plasma doping and postimplant processing of silicon using medium energy ion scattering;Journal of Vacuum Science & Technology B;2019-05
3. Use of TRIDYN and medium energy ion scattering to calibrate an industrial arsenic plasma doping process;Journal of Vacuum Science & Technology B;2019-05
4. JGIXA — A software package for the calculation and fitting of grazing incidence X-ray fluorescence and X-ray reflectivity data for the characterization of nanometer-layers and ultra-shallow-implants;Spectrochimica Acta Part B: Atomic Spectroscopy;2016-04
5. Evolution of arsenic in high fluence plasma immersion ion implanted silicon: Behavior of the as-implanted surface;Applied Surface Science;2015-11
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