Author:
Akgul Bekir,Erden Fuat,Ozbay Salih
Subject
General Chemical Engineering
Reference65 articles.
1. Investigation on interaction between indium based thermal interface material and copper and silicon substrates;Fałat,2013
2. Analytical modeling for prediction of hot spot chip junction temperature for electronics cooling applications;Iyengar,2006
3. Experimental investigation on the mechanical, structural and thermal properties of Cu–ZrO2 nanocomposites hybridized by graphene nanoplatelets;Abd-Elwahed;Ceram. Int.,2020
4. Three-dimensional porous copper-graphene Heterostructures with durability and high heat dissipation performance;Rho;Sci. Rep.,2015
5. Copper-graphite-copper sandwich: Superior heat spreader with excellent heat-dissipation ability and good weldability;Jiang;RSC Adv.,2016
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