Funder
National Research Foundation of Korea
Sun Moon University
Korea Science and Engineering Foundation
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference26 articles.
1. Recent advances in passive immersion cooling of high power devices;Bar-Cohen,1997
2. Liquid-cooling of electronic equipment: where does it offer viable solutions?;Nakayama,1997
3. Electronic packaging in the 1990’s—a perspective from America;Tummala;IEEE Comp. Hybrids Manuf. Technol.,1991
4. Electronic packaging in the 1990’s—a perspective from Asia;Ohsaki;IEEE Comp. Hybrids Manuf. Technol.,1991
5. State-of-the-art multichip modules for avionics;Hagge;IEEE Comp. Hybrids Manuf. Technol.,1992
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