Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference18 articles.
1. Ferger C. In: Doane DA, Franzon PD, editors. Multichip module technologies and alternatives. New York: Van Nostrand Reinhold; 1993. p. 311.
2. Mittal KL, editor. Polyimides: synthesis, characterization and applications, vols. 1 and 2. New York: Plenum Press; 1984.
3. Matienzo LJ, Unertl WN. In: Ghosh MK, Mittal KL, editors. Polyimides: fundamentals and applications. New York: Marcel Dekker; 1996. p. 629.
4. Surface properties of chemically modified polyimide films
5. Adhesion interaction between electrolessly deposited copper film and polyimide
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