Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending-Reference-Cited by-同舟云学术

Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending

Published:2009-02 Issue:2 Volume:51 Page:152-158
ISSN:0020-7403
Container-title:International Journal of Mechanical Sciences
language:en
Short-container-title:International Journal of Mechanical Sciences

Author:

Wong E.H.,Wong C.K.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering

Reference10 articles.

1. Wong EH, Lim KM, Lee N, Seah SKW, Koh C, Wang J. Drop impact test—mechanics and physics of failure. In: Proceedings of the fourth electronic packaging technology conference, 2002. p. 327–33.

2. Thermal stresses in composite beams;Boley;International Journal of Solids and Structures,1969

3. Thermal stresses in bolted joints;Chen;IBM Journal of Research and Development,1979

4. Thermal stress in laminated beams;Chen;Journal of Thermal Stress,1982

5. Thermal stress failures in microelectronic components—review and extension;Suhir,1988

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