The temperature dependence of component failure rate-Reference-Cited by-同舟云学术

The temperature dependence of component failure rate

Published:1980-01 Issue:3 Volume:20 Page:297-307
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Blanks H.S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Focus on cooling electronic packages;McDermott;Electron. Des.,1974

2. The Theory of Rate Processes;Glasstone,1941

3. Reliability physics—an assessment;Vaccaro,1970

4. Electromagnetic Machines;Langlois-Berthelot,1953

5. Practical applications of accelerated Testing—introduction;Peck,1975

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