Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part A: Stress analyses and material characterization-Reference-Cited by-同舟云学术

Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part A: Stress analyses and material characterization

Published:1986-01 Issue:4 Volume:26 Page:715-732
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Vecchio K.S.,Hertzberg R.W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Mechanical Properties at Elevated Temperature of Cu Bath Electroplated Copper for Multilayer Boards;Fox;Journal of Testing and Evaluation,1976

2. Methods for Evaluating Plated-Through Hole Reliability;Oien,1976

3. A Simple Model for the Thermomechanical Deformations of Plated-Through-Holes in Multilayer Printed Wiring Boards;Oien,1976

4. Applications of Ductile Electroless Copper Deposition of Printed Circuit Boards;Honma;Japan Metal Finishing Technology,1983

5. Microstructure and Ductility of Electroless Copper Deposites;Nakahara;Acta Metall.,1983

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