Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von Kármán's equations with consideration of thermoelastic strains-Reference-Cited by-同舟云学术

Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von Kármán's equations with consideration of thermoelastic strains

Published:1997-08 Issue:23 Volume:34 Page:2991-3019
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Suhir E.

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Reference29 articles.

1. Moisture absorption and mechanical performance of surface mountable plastic packages;Bhattachayya,1988

2. Popcorn effect in reflow soldering of surface mounted assemblies in plastic housing;Cognett;Electronik,1988

3. Impact of moisture/reflow induced delaminations on integrated circuit thermal performance;Conrad,1994

4. Moisture-induced stress sensitivity for plastic surface mount devices;EIA/JEDEC Standard,1995

5. Desorption equilibrium moisture relationships for popcorn;Flood;Transactions of the American Society of Agricultural Engineers,1984

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