Fatigue crack growth behavior in Sn–Pb eutectic solder/copper joint under mode I loading

Author:

Kanchanomai C.,Limtrakarn W.,Mutoh Y.

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Materials Science,Instrumentation

Reference20 articles.

1. Fracture Mechanics: Fundamental and Applications;Anderson,1994

2. ASTM: E647, 1998. Standard Test Method for Measurement of Fatigue Crack Growth Rates. ASTM standards, The American Society for Testings and Materials. 03.01, pp. 562–598.

3. Metallurgical reactions at the interface of Sn/Pb solder and electroless copper-plated AlN substrate;Chiou;IEEE Transaction of Component, Hybrids and Manufacturing Technology—Part B,1995

4. Mathematical Theory of Dislocations;Dundurs,1969

5. Crack paralleling an interface between dissimilar materials;Hutchinson;Journal of Applied Mechanics,1987

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