The interfacial behavior of an axisymmetric film bonded to a graded inhomogeneous substrate-Reference-Cited by-同舟云学术

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The interfacial behavior of an axisymmetric film bonded to a graded inhomogeneous substrate

Published:2024-06 Issue: Volume:193 Page:104983
ISSN:0167-6636
Container-title:Mechanics of Materials
language:en
Short-container-title:Mechanics of Materials

Author:

Li Dengke,Chen Peijian^ORCID,Liu Hao,Peng Zhilong,Guler Mehmet Ali^ORCID,Chen Shaohua

Funder

NSFC

Publisher

Elsevier BV

Reference80 articles.

1. Thermodynamic assessment of a novel multi-generation solid oxide fuel cell-based system for production of electrical power, cooling, fresh water, and hydrogen;Abdollahi Haghghi;Energy Convers. Manag.,2019

2. Growth and characterization of NiO films on aluminum substrate as thermal interface material for LED application;Ahmed;Surf. Coat. Technol.,2018

3. A coupled phase field formulation for modelling fatigue cracking in lithium-ion battery electrode particles;Ai;J. Power Sources,2022

4. The edge cracking and decohesion of thin films;Akisanya;Int. J. Solid Struct.,1994

5. Stress analysis for a thin film bonded to an orthotropic substrate under thermal loading;Alinia;Mech. Res. Commun.,2020

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