Dynamic recrystallization during high temperature fatigue-Reference-Cited by-同舟云学术

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Dynamic recrystallization during high temperature fatigue

Published:1986-10 Issue:10 Volume:20 Page:1343-1346
ISSN:0036-9748
Container-title:Scripta Metallurgica
language:en
Short-container-title:Scripta Metallurgica

Author:

Raman V.,Reiley T.C.

Publisher

Elsevier BV

Subject

General Engineering

Reference18 articles.

1. Superplastic deformation of the Pb-Sn eutectic

2. The distribution of deformation in lead fatiguedin vacuo

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder;MATERIALS TRANSACTIONS;2004

2. Fatigue crack growth behaviour of lead‐containing and lead‐free solders;Soldering & Surface Mount Technology;2002-12-01

3. Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials;Journal of Electronic Materials;2001-04

4. Fatigue crack growth behavior of 95Pb–5Sn solder under various stress ratios and frequencies;International Journal of Fatigue;2000-09

5. The Effect of Morphology Coarseness on Vibration Fracture Behavior of Pb–Sn Solders under Various Aging Conditions;Materials Transactions, JIM;2000

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