Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference41 articles.
1. Polyimides: fundamentals and applications;Ressano,1996
2. Handbook of semiconductor manufacturing technology,2000
3. Surface modification of BPDA-PDA polyimide
4. Surface modification of Kapton film by plasma treatments
5. Plasma surface modification of polyimide for improving adhesion to electroless copper coatings
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