Computer simulation of spatial arrangement and connectivity of particles in three-dimensional microstructure: Application to model electrical conductivity of polymer matrix composite-Reference-Cited by-同舟云学术

Computer simulation of spatial arrangement and connectivity of particles in three-dimensional microstructure: Application to model electrical conductivity of polymer matrix composite

Published:1996-04 Issue:4 Volume:44 Page:1519-1528
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Louis P.,Gokhale A.M.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Three-dimensional simulation of flow through a porous medium

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3. On Stereological Estimation of Second‐order Characteristics and of the Hard‐core Distance of Systems of Sphere Centres

4. Numerical simulation of diffusion-controlled droplet growth: Dynamical correlation effects

5. Application of image analysis for characterization of spatial arrangements of features in microstructure

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