1. Cure behavior, morphology, and mechanical properties of the melt blends of epoxy with polyphenylene oxide;Wu;J. Appl. Polym. Sci.,2000
2. Tracy JE, Yeager GW. Curable polyphenylene ether and thermosetting polymer compositions foe printed-circuit boards and their fiber-reinforced plastics. JP 99302,529, 1999–11–02.
3. Yuan J, Johnson GE, Paczkowski MA. Novel epoxy/PPE laminate for high-performance applications. International SAMPE Electronics Conference, SAMPE, Covina, CA, USA 1994(7):211–20.
4. Kinetic study of polymerization/curing of filament-wound composite epoxy resin systems with aromatic diamines;Golub;J. Appl. Polym. Sci.,1986
5. Processing of intractable polymers using reactive solvents: 1. Poly 2,6-dimethyl-1,4-phenylene ether/epoxy resin;Venderbosch;Polymer,1994