Author:
WU Mao,QU Xuan-hui,HE Xin-bo,Rafi-ud-din ,REN Shu-bin,QIN Ming-li
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference31 articles.
1. Composites for electronic packaging and thermal management [C];CHUNG,2003
2. Materials for thermal conduction [J];CHUNG;Appl Therm Eng,2001
3. Advanced electronic packaging materials [J];ZWEBEN;Adv Mater Process,2005
4. Copper matrix SiC and Al2O3 particulate composites by powder metallurgy technique [J];MOUSTAFA;Mater Lett,2002
5. Investigation of the corroded surface of SiCw/Al composite [J];HU;Appl Surf Sci,2004
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