Simulation of thermal effects in integrated circuits with SPICE - a behavioural model approach-Reference-Cited by-同舟云学术

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Simulation of thermal effects in integrated circuits with SPICE - a behavioural model approach

Published:1993-12 Issue:8 Volume:24 Page:849-861
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Rudolph H.

Publisher

Elsevier BV

Subject

General Engineering

Reference7 articles.

1. Computer simulation of integrated circuits in the presence of electrothermal interaction;Fukahori;IEEE J. Solid-State Circuits,1976

2. Thermal properties of fast transistors;Joy;IEEE Electron Devices,1970

3. Methods for the thermal analysis of integrated circuits within the design phase;Rudolph,1991

4. Extending SPICE for electrothermal simulation;Vogelsong,1989

5. Scalable small0signal model for BJT self-heating;Fox;IEEE Electron Device Letters,1991

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A PSpice Model for the Study of Thermal Effects in Capacitive MEMS Accelerometers;Procedia Engineering;2013

2. A simple analog behavioural model for NTC thermistors including selfheating effect;Sensors and Actuators A: Physical;2005-02

3. Monolithic integrated active sensors: a combination technology for thin-film and semiconductor devices;Analog Integrated Circuits and Signal Processing;1993-07

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