Effect of La on the Sn-rich halo formation in Sn60–Pb40 alloy-Reference-Cited by-同舟云学术

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Effect of La on the Sn-rich halo formation in Sn60–Pb40 alloy

Published:2001-08 Issue:1-2 Volume:327 Page:263-266
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Ma Xin,Qian Yiyu,Yoshida F.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference15 articles.

1. Solders in electronics

2. Solder Joint Reliability: Theory and Application,1992

3. Fracture behavior of 63sn-37pb solder

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3. Halo formation of Zn-Al alloys under conventional solidification and intensive convection solidification;Journal of Alloys and Compounds;2017-03

4. Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging;IEEE Transactions on Electron Devices;2012-12

5. Effect of La addition on adhesive strength and fracture behavior of Sn–3.5Ag solder joints;Materials Science and Engineering: A;2011-04

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