Author:
Kangarlou Haleh,Aghgonbad Maryam Motallebi
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Grain growth, agglomeration and interfacial reaction of copper interconnects;Yang;Thin Solid Films,2002
2. Atomic layer deposition of ultrathin copper metal films from a liquid copper(I) amidinate precursor;Li;J. Electrochem. Soc.,2006
3. Growth of copper thin films on sputtered-TiN surfaces by metallorganic chemical vapour deposition from (hfac) Cu(I)(VTMS);Yoen;J. Mater. Sci.: Mater. Electron.,1997
4. Physical and mechanical properties of copper and copper alloys;Li;Compr. Nucl. Mater.,2012
5. Study of the structure and properties of thick vacuum condensates of nickel, titanium, tungsten, aluminium oxide and zirconium dioxide;Movchan;Phys. Met. Metallogr.,1969
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献