The lifetime prediction of epoxy resin adhesive based on small-sample data

Author:

Zhu Yipeng,Zhao Tingdi,Jiao JianORCID,Chen Zhiwei

Publisher

Elsevier BV

Subject

General Engineering,General Materials Science

Reference25 articles.

1. The degradation of epoxy resin by partial discharge stressing;Hepburn,1994

2. Experimental and Modelling Study on the Durability Performance of Adhesively Bonded Joint in Hygro-Thermal Environment;Xiao,2014

3. Study on Environment Behavior and Aging Mechanism of Epoxy Adhesive;Gao,2006

4. Model-fitting and model-free nonisothermal curing kinetics of epoxy resin with a low-volatile five-armed starlike aliphatic polyamine;Wan;Thermochim. Acta,2011

5. Research advances in epoxy resin curing kinetics;Zhang;Mater. Rev.,2009

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