Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator-Reference-Cited by-同舟云学术

Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator

Published:2011-04 Issue:3 Volume:25 Page:884-900
ISSN:0888-3270
Container-title:Mechanical Systems and Signal Processing
language:en
Short-container-title:Mechanical Systems and Signal Processing

Author:

Feng Wuwei,Meng Qingfeng,Xie Youbo,Fan Hong

Publisher

Elsevier BV

Subject

Computer Science Applications,Mechanical Engineering,Aerospace Engineering,Civil and Structural Engineering,Signal Processing,Control and Systems Engineering

Reference16 articles.

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3. Wire-bonding process monitoring using thermopile temperature sensor;Suman;IEEE Transaction on Advanced Packaging,2005

4. Investigation of ultrasonic vibrations of wire bonding capillaries;Zhong;Microelectronics Journal,2005

5. H. Gaul, M.S. ramelow, K.D. Lang, H. Reichl, Predicting the shear strength of a wire bond using laser vibration measurements, in: Proceedings of the IEEE Electronics system integration Technology Conference, vol. 4, Dresden, Germany, 2005, pp. 719–725.

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