High aspect ratio via etching conditions for deep trench of silicon-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

High aspect ratio via etching conditions for deep trench of silicon

Published:2003-07 Issue:1-3 Volume:171 Page:290-295
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Park W.J.,Kim J.H.,Cho S.M.,Yoon S.G.,Suh S.J.,Yoon D.H.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference12 articles.

1. Etching of Si with Cl2 using an electron cyclotron resonance source

2. Etched Shape Control of Single‐Crystal Silicon in Reactive Ion Etching Using Chlorine

3. Characterization of BCl3 ‐ Cl2 Silicon Trench Etching

4. Effects on sidewall profile of Si etched in BCl3/Cl2 chemistry

5. Microtrenching resulting from specular reflection during chlorine etching of silicon

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. One-Dimensional Silicon Nano-/microstructures Based Opto-Electronic Devices;Topics in Applied Physics;2022

2. Influence of fabrication tolerances on performance characteristics of a MEMS gyroscope;Microsystem Technologies;2020-10-24

3. New Power MOSFET with Beyond-1D-Limit RSP-BV Trade-Off and Superior Reverse Recovery Characteristics;Materials;2020-06-05

4. Deep Dry Etching of Silicon with Scallop Size Uniformly Larger than 300 nm;Silicon;2018-07-09

5. Manufacturing of a Compact Micro Air Bearing Device for Power Micro Electro Mechanical System (MEMS) Applications Using Silica Film Assisted Processing;Micromachines;2018-04-02

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3