Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process-Reference-Cited by-同舟云学术

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Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process

Published:2017-12 Issue: Volume:392-393 Page:93-98
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Kim Hojoong,Hong Seokjun,Shin Cheolmin,Jin Yinhua,Lim Dong Hyun,Kim Jun-yong,Hwang Hasub,Kim Taesung

Funder

Ministry of Education, Science and Technology

National Research Foundation of Korea

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference16 articles.

1. CMP pad surface roughness and CMP removal rate;Oliver;Electrochem. Soc. S,2001

2. Effect of CMP conditioner diamond shape on pad topography and oxide wafer performances;Tsai;Int. J. Adv. Manuf. Technol.,2011

3. Pad porosity, compressibility and slurry delivery effects in chemical-mechanical planarization: modeling and experiments;Thakurta;Thin Solid films,2000

4. Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMP;Li;J. Electrochem. Soc.,2004

5. Effect of temperature on pad surface contact area in chemical mechanical planarization;Jiao;ECS Solid State Lett.,2012

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers;Materials Science in Semiconductor Processing;2024-12

2. Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad;ECS Journal of Solid State Science and Technology;2024-03-15

3. Nanoscale tribological aspects of chemical mechanical polishing: A review;Applied Surface Science Advances;2022-10

4. Polishing of polycrystalline diamond using synergies between chemical and mechanical inputs: A review of mechanisms and processes;Carbon;2022-08

5. Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing;Precision Engineering;2022-03

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