A fundamental model proposed for material removal in chemical–mechanical polishing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Reference76 articles.
1. Chemical–mechanical polishing for fabricating patterned W metal features as chip interconnects;Kaufman;J. Electrochem. Soc.,1991
2. Chemical processes in glass polishing;Cook;J. Non-Cryst. Solids,1990
3. Chemical Mechanical Planarization of Microelectronic Materials;Steigerwald,1997
4. Physical characterization of chemical mechanical planarized surface for trench isolation;Ali;J. Electrochem. Soc.,1995
5. Application of chemical mechanical polishing to the fabrication of VLSI circuit interconnections;Patrick;J. Electrochem. Soc.,1991
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