The interplay between universities and companies. A case study in the field of 3D Printing
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Published:2024-06
Issue:
Volume:77
Page:102267
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ISSN:0172-2190
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Container-title:World Patent Information
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language:en
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Short-container-title:World Patent Information
Author:
Breckwoldt Jurado AltairORCID,
Golzio Domenico
Funder
Universitat Jaume I