Effect of whole chia seed flour on gelling properties, microstructure and texture modification of tofu
Author:
Funder
Ministry of Science and Technology, Taiwan
Publisher
Elsevier BV
Subject
Food Science
Reference49 articles.
1. Texture-modified foods for the elderly: Status, technology and opportunities;Aguilera;Trends in Food Science & Technology,2016
2. Official methods of analysis;Aoac,2000
3. Dietary intakes of flavonols, flavones and isoflavones by Japanese women and the inverse correlation between quercetin intake and plasma LDL cholesterol concentration;Arai;Journal of Nutrition,2000
4. Protein content, oil content and fatty acid profiles as potential criteria to determine the origin of commercially grown chia (Salvia hispanica L.);Ayerza;Industrial Crops and Products,2011
5. Texture profile analysis;Bourne;Food Technology,1978
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