A modified Kirchhoff plate theory for analyzing thermo-mechanical static and buckling responses of functionally graded material plates
Author:
Funder
FOSTECT
Publisher
Elsevier BV
Subject
Mechanical Engineering,Building and Construction,Civil and Structural Engineering
Reference69 articles.
1. Gradients in composite materials;Bever;Mater. Sci. Eng.,1972
2. Enhanced thermal stress resistance of structural ceramics with thermal conductivity gradient;Hasselman;J. Am. Ceram. Soc.,1978
3. Functionally gradient materials the concept of FGM;Koizumi;Ceram. Trans.,1993
4. Large deformation analysis of functionally graded shells;Arciniega;Int. J. Solids Struct.,2007
5. Three-dimensional transient heat conduction in a functionally graded thick plate with a higher-order plate theory and a meshless local Petrov–Galerkin method;Qian;Comput. Mech.,2005
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