Surface microtexturing design, laser-etching and adhesive failure of aluminum alloy single-lap-joint: Experiment and simulation
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Building and Construction,Civil and Structural Engineering
Reference60 articles.
1. Fracture behavior of a self-healing, toughened epoxy adhesive;Jin;International Journal of Adhesion and Adhesives,2013
2. Analysis of manufacturing parameters on the shear strength of aluminium adhesive single-lap joints;Pereira;Journal of Materials Processing Technology,2010
3. Macroscopic strength and failure properties of flow-drill screw connections;Sønstabø;Journal of Materials Processing Technology,2015
4. Techniques to weld similar and dissimilar materials by ATIG welding - an overview;Patel;Materials and Manufacturing Processes,2020
5. Joining of carbon fibre reinforced polymer (CFRP) composites and aluminium alloys – A review;Pramanik;Composites Part A: Applied Science and Manufacturing,2017
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of bionic texture on the mechanical properties of 6061Al/CFRTP laser joints;Thin-Walled Structures;2024-12
2. Effect of laser micromachining crater-array–multi-grooves on the bonding strength and failure mode of aluminum alloy adhesive joints;Optics & Laser Technology;2024-08
3. A comprehensive investigation on tensile behavior of surface‐modified Kevlar hybrid nanocomposites for similar and dissimilar joints;Polymer Composites;2024-03-21
4. Surface Roughness Effects on the Fracture Behavior of Adhesively Bonded Joints;AIAA SCITECH 2024 Forum;2024-01-04
5. Adhesive Bonding Operations for Aeronautical Materials;Sustainable Aviation;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3