Stress dependence of creep in bonded adhesives-Reference-Cited by-同舟云学术

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Stress dependence of creep in bonded adhesives

Published:1980-06 Issue:1 Volume:44 Page:57-62
ISSN:0025-5416
Container-title:Materials Science and Engineering
language:en
Short-container-title:Materials Science and Engineering

Author:

Hughes Edward J.,Rutherford John L.

Publisher

Elsevier BV

Subject

General Engineering

Reference9 articles.

1. Capacitance Methods for Measuring Properties of Adhesives in Bonded Joints

2. Torsion apparatus for measuring shear properties of adhesive bonded joints

3. Study of micromechanical properties of adhesive bonded joints;Hughes;Picatinny Arsenal, Dover, New Jersey, Final Rep.,1968

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Moisture on the Dimensional Stability of Adhesively Bonded Joints;Adhesive Joints;1984

2. Modelling of ICA creep properties;4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

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