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Investigation of residual stresses in microsystems using X-ray diffraction

  • Published:2000-09 Issue:2 Volume:288 Page:119-125
  • ISSN:0921-5093
  • Container-title:Materials Science and Engineering: A
  • language:en
  • Short-container-title:Materials Science and Engineering: A

Author:

Kämpfe Bernd

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Mikromechanik und Chipverbindungstechnik;Reichl,1989

2. B. Michel, Proceedings of the Micro Mat ‘97, Berlin, 16–18 April 1997, pp. 382–389.

3. R.R. Tumalla, Proceedings of the Micro Mat ‘97, Berlin, 16–18 April 1997, pp. 64–70.

4. V.A. Kogan, J. Bethke, Proceedings of the EPDIC 97.

5. A. Schubert, B. Kämpfe, M. Ermrich, E. Auerswald, K. Tränkner, Proceedings of the EPDIC 3, Material Science Forum, 1993, pp. 151–156.

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