Fault Diagnosis of Flip Chip Using Vibration and Modal Analysis
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference11 articles.
1. The Development of a Top-Bottom-BGA (TB-BGA);Rudolf;In:1998 International Conference on Multichip Modules and High Density Packaging,1988
2. Analysis of flip-chip packaging challenges on copper/low-k interconnects;Mercado;IEEE Trans. Device and Materials Reliability,2003
3. Automated inspection and classification of flip-chip contacts using scanning acoustic microscopy;Brand;Microelectronics Reliability.,2010
4. Sassov A, Luypaert F. X ray digital microlaminography for BGA and flip chip inspection. X ray Microscopy: Proceedings of the Sixth International Conference, 2000, 239-244.
5. Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods;Yang;IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control,2010
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