Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging

Published:2018-01 Issue: Volume:135 Page:238-244
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Liu Jihou,Zhao Hongyun,Li Zhuolin,Song Xiaoguo,Zhao Yixuan,Niu Hongwei,Tian Hao,Dong Hongjie,Feng Jicai

Funder

Natural Science Foundation of China

Harbin Institute of Technology

National Natural Science Foundation of China

Shanghai Aerospace Innovation Fund

National Science and Technology Major Project

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference40 articles.

1. Recent advances on dielectrics technology for SiC and GaN power devices;Roccaforte;Appl. Surf. Sci.,2014

2. Power conversion with SiC devices at extremely high ambient temperatures;Tsuyoshi;IEEE Trans. Power Electron.,2007

3. P–N junction and metal contact reliability of SiC diode in high temperature (873K) environment;Chand;Solid State Electron.,2014

4. SiC versus Si-evaluation of potentials for performance improvement of inverter and DC-DC converter systems by SiC power semiconductors;Biela;IEEE Trans. Ind. Electron.,2011

5. High temperature stability and the performance degradation of SiC MOSFETs;Zhou;IEEE Trans. Power Electron.,2014

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging;Materials Characterization;2024-04

2. Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process;Journal of Materials Science: Materials in Electronics;2023-06

3. Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging;Journal of Electronic Packaging;2022-12-09

4. High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process;Materials Chemistry and Physics;2022-10

5. Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu₃Sn Paste for High-Power Electronics Packaging;ACS Applied Electronic Materials;2022-07-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3