Interfacial microstructure and mechanical properties of tungsten alloy/steel diffusion bonding joint using CrFeCoNiCu high entropy alloy interlayer-Reference-Cited by-同舟云学术

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Interfacial microstructure and mechanical properties of tungsten alloy/steel diffusion bonding joint using CrFeCoNiCu high entropy alloy interlayer

Published:2023-05 Issue: Volume:199 Page:112837
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Zhang Mengxiang,Zhu Wentan,Meng Shangru,Liu Wensheng,Ma Yunzhu,Wang Jianning,Sun Huanteng,Cai Qingshan

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference53 articles.

1. Interfacial structure and formation mechanism of tungsten/steel HIP diffusion bonding joints using Ni interlayer;Wang;J. Manuf. Process.,2020

2. Microstructural characteristics, mechanical properties and interfacial formation mechanism of tungsten alloy/steel composite structure fabricated by HIP co-sintering;Zhu;Mater. Des.,2021

3. Influence of Fe-W intermetallic compound on fracture behavior of Steel/Tungsten HIP diffusion bonding joint: experimental investigation and first-principles calculation;Lu;J. Manuf. Process.,2020

4. Interfacial microstructures, residual stress and mechanical analysis of hot isostatic pressing diffusion bonded joint of 93W–4.9Ni–2.1Fe alloy and 30CrMnSiNi2A steel;Liu;Fusion Eng. Design,2020

5. Effect of holding time on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer;Zhong;Mater. Sci. Eng. A,2009

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3. Interfacial structure and formation mechanism of 90 W-7Ni-3Fe/steel using co-sintering method;International Journal of Refractory Metals and Hard Materials;2024-08

4. Significantly improved bonding strength of Al/Mg bimetallic interface by compound casting via FeCoNiCrCu high entropy alloy coating;Journal of Materials Research and Technology;2024-05

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