The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys-Reference-Cited by-同舟云学术

The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys

Published:2014-10 Issue: Volume:96 Page:115-125
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Spinelli José Eduardo^ORCID,Silva Bismarck Luiz,Cheung Noé,Garcia Amauri

Funder

FAPESP

CNPq

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference35 articles.

1. Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications;Kim;J. Alloys Compd.,2014

2. Effects of silver and antimony content in lead-free high-temperature solders of Bi–Ag and Bi–Sb on copper substrate;Nahavandi;J. Electron. Mater.,2014

3. Development of high-temperature solders: review;Zeng;Microelectron. Reliab.,2012

4. Wetting and soldering behavior of eutectic Au–Ge alloy on Cu and Ni substrates;Leinenbach;J. Electron. Mater.,2011

5. Wetting of Cu and Al by Sn–Zn and Zn–Al eutectic alloys;Pstruś;J. Mater. Eng. Perform.,2012

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging;Journal of Materials Science: Materials in Electronics;2024-09

2. Effect of Indium on Microstructures and Mechanical Properties of Bismuth-Based High Temperature Solders;MATERIALS TRANSACTIONS;2024

3. Doğrusal Katılaştırılmış Sn-Zn Ötektik Alaşımında Altsoğumanın Hesaplanması;Bilecik Şeyh Edebali Üniversitesi Fen Bilimleri Dergisi;2023-05-31

4. The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder;Soldering & Surface Mount Technology;2022-06-28

5. Hypereutectic Zn–Al Alloys: Microstructural Development under Unsteady-State Solidification Conditions, Eutectic Coupled Zone and Hardness;Metals;2022-06-23