Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale-Reference-Cited by-同舟云学术

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Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale

Published:2023-11 Issue: Volume:27 Page:2490-2507
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Liu Jiaxin,Lv Weishan,Mou Yun,Chen Cai,Kang Yong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference48 articles.

1. Cu-Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol;Tan;Appl Phys Lett,2009

2. Preparation of PVP coated Cu NPs and the application for low-temperature bonding;Yan;J Mater Chem,2011

3. Die bonding performance using bimodal Cu particle paste under different sintering atmospheres;Gao;J Electron Mater,2017

4. Recent advances in the synthesis of copper-based nanoparticles for metal-metal bonding processes;Kobayashi;J Sci-Adv Mater Dev,2016

5. Effect of sintering conditions on the mechanical strength of Cu-sintered joints for high-power applications;Yoon;Materials,2018

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Coalescence of Al2O3/Al, MgO/Mg, and MgO/Al two nanoparticles during combustion;Applied Surface Science;2024-03

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