Advance understanding of the synthesis process, special performance, and multidiscipline applications of SiC nanowires and the constructed composites
Author:
Funder
Chongqing Natural Science Foundation
Chongqing Municipal Education Commission
Publisher
Elsevier BV
Reference160 articles.
1. Power-loss prediction of high-voltage SiC-mosfet circuits with compact model including carrier-trap influences;Yuta;IEEE Trans Power Electron,2016
2. High-power microwave GaN/alGaN HEMTs and MMICs on SiC and silicon substrates for modern radio communication;Quay;Phys Status Solidi A,2018
3. On the techniques to utilize SiC power devices in high- and very high-frequency power converters;Tong;IEEE Trans Power Electron,2019
4. High-performance SiC/SiC composites by improved PIP processing with new precursor polymers;Kohyama;J Nucl Mater,2000
5. Advancements in SiC-reinforced metal matrix composites for high-performance electronic packaging: a review of thermo-mechanical properties and future trends;Lai;Micromachines,2023
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