Hybrid plasma bonding of germanium and glass wafers at low temperature-Reference-Cited by-同舟云学术

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Hybrid plasma bonding of germanium and glass wafers at low temperature

Published:2010-07 Issue:13 Volume:64 Page:1532-1535
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Howlader M.M.R.,Kibria M.G.,Zhang F.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. Resonant Cavity Enhanced Ge Photodetectors for 1550 nm Operation on Reflecting Si Substrates

2. Germanium-on-glass near-infrared detectors

3. High performance germanium-on-silicon detectors for optical communications

4. Low Dark-Current Germanium-on-Silicon Near-Infrared Detectors

5. Wafer Bonding and Layer Splitting for Microsystems

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1. Direct bonding of Germanium and Diamond substrates by reduction process;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Machining technologies and structural models of microfluidic devices;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2024-03-23

3. Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain;ACS Omega;2024-02-14

4. Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain;ACS OMEGA;2024

5. Effect of wood and graphite fillers on the glass fiber reinforced composite;Materials Letters;2021-02

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