Self-assembled layer as an effective way to block copper diffusion into epoxy-Reference-Cited by-同舟云学术

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Self-assembled layer as an effective way to block copper diffusion into epoxy

Published:2024-07 Issue: Volume:367 Page:136589
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Zhao Shuaijie^ORCID,Chen Chuantong,Nishijima Masahiko,Haga Motoharu,Ueshima Minoru,Suzuki Hirose,Takenaka Hiroto,Suganuma Katsuaki

Funder

Ministry of Education, Culture, Sports, Science and Technology

Japan Society for the Promotion of Science

Publisher

Elsevier BV

Reference12 articles.

1. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature;Zhao;Compos. Part B Eng.,2023

2. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate;Zhao;Microelectron. Reliab.,2023

3. Diffusion of metals in polymers;Faupel;Mater. Sci. Eng. R Reports.,1998

4. Copper electrochemical migration growth in an air HAST;Oh;Microelectron. Reliab.,2019

5. Copper diffusion into epoxy under high temperature;Zhao;Mater. Lett.,2024

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