Fracture test for double cantilever beam of honeycomb sandwich panels
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. Debonding and crack kinking in foam core sandwich beams-I. Analysis of fracture specimens;Prasad;Eng Fract Mech,1994
2. Debonding and crack kinking in foam core sandwich beams-II. experimental investigation;Prasad;Eng Fract Mech,1994
3. A test technique for assessing core-skin adhesion in composite sandwich structures;Cantwell;J Mater Sci Lett,1994
4. A study of skin-core adhesion in glass reinforced sandwich materials;Cantwell;Appl Compos Mater,1996
5. Interfacial fracture in sandwich laminates;Cantwell;Compos Sci Technol,1999
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Pseudo-equivalent model for sandwich panels with egg-shaped honeycomb-grid core;International Journal of Mechanical Sciences;2024-08
2. S-çekirdekli sandviç panel kompozitin üç nokta eğme davranışları: Sonlu eleman modelleme ve deneysel incelemesi;Gazi Üniversitesi Mühendislik Mimarlık Fakültesi Dergisi;2024-05-20
3. Experimental and FEM investigation of bending behaviors of S-core sandwich panel composites;International Journal of Solids and Structures;2024-01
4. Compression performance and analytical model of hexagonal-core sandwich panels fabricated by 3D printed continuous carbon fiber-reinforced thermosetting epoxy composites;Materials Research Express;2022-08-01
5. Debonding characteristics and strengthening mechanics of all-CFRP sandwich beams with interface-reinforced honeycomb cores;Composites Science and Technology;2022-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3