Effect of substrate temperature on the thermal stability of Cu/Zr–N/Si contact system
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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1. Research of CoSiN Film as Diffusion Barrier in ULSI-Cu Metallization;Advanced Materials Research;2014-07
2. The influence of substrate-target orientation on the properties of ZrN films deposited by arc ion plating;Physics Procedia;2011
3. Diffusion barrier capability of Zr–Si films for copper metallization with different substrate bias voltage;Thin Solid Films;2009-07
4. Thermal Stability of TaN-Based Thin Layers for Cu Metallization;Plasma Processes and Polymers;2009-06
5. Diffusion barrier performance of Zr–N/Zr bilayered film in Cu/Si contact system;Microelectronics Reliability;2008-11
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