Fabrication and characterization of eutectic bismuth–tin (Bi–Sn) nanowires
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Strain-Life Behavior in 60/40 Solder
2. Superplastic creep of eutectic tinlead solder joints
3. Lead (Pb)-free solders for electronic packaging
4. Pb-free solders for flip-chip interconnects
5. A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
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