Wetting of microcrystalline and nanocrystalline Ni substrates by molten Sn–3.5Ag–0.7Cu alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference12 articles.
1. Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
2. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
3. A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
4. Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
5. Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition;Journal of Materials Engineering and Performance;2022-04-11
2. Effects of substrate annealing on wettability and intermetallic compound formation in Sn–3.0Cu/Cu systems;Journal of Materials Science: Materials in Electronics;2019-05-29
3. Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy;Materials & Design;2017-04
4. Wettability in reactive Sn-base alloy/Ni-base metallic glass systems;Applied Surface Science;2013-07
5. In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology;Journal of Alloys and Compounds;2012-10
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