A low cost multi-shapes designed sintering composite paste: A strengthening method of sintered interconnect for die attach in high temperature applications-Reference-Cited by-同舟云学术

A low cost multi-shapes designed sintering composite paste: A strengthening method of sintered interconnect for die attach in high temperature applications

Published:2022-05 Issue: Volume:315 Page:131884
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Li Ke,Liu Yang,Zhang Jing,Xiao Nan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Characterization of thermal sprayed Si on sintered SiC for space optical applications;Jalluri;Surf. Eng.,2020

2. A novel 4H-SiC MOSFET for low switching loss and high-reliability applications;Han;Semicond Sci. Tech.,2020

3. Comparison of Si and SiC EMI and Efficiency in a Two-Level Aerospace Motor Drive Application;Perdikakis;Ieee Transac. Transp. Electr.,2020

4. A Review of SiC IGBT: Models, Fabrications, Characteristics, and Applications;Han;Ieee Transac. Power Electr.,2021

5. In Situ Observation of Electromigration-Induced Anomalous Precipitation of Ag3Sn Phase in Ag-Containing Solder Joints;Zhang;J. Electron. Mater.,2021

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