Electromigration failure model: its application to W plug and Al-filled vias-Reference-Cited by-同舟云学术

Electromigration failure model: its application to W plug and Al-filled vias

Published:1998-05 Issue:1 Volume:320 Page:45-51
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Kawasaki H,Gall M,Jawarani D,Hernandez R,Capasso C

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. H. Kawasaki, C. Lee, S.G.H. Anderson, F. Pintchovski, in: P.S. Ho, J. Bravman, C.-Y. Li, J. Sanchez (Eds.), Proceedings of the Third International Workshop on Stress-Induced Phenomena in Metallization, AIP Conf. Proc. 373 (1995) 185.

2. M. Gall, D. Jawarani, H. Kawasaki, in: W.F. Filter, J.J. Clement, A.S. Oates, R. Rosenberg, P.M. Lenahan (Eds.), Materials Res. Soc. Symp. Proc. 428 (1996) 81.

3. H. Kawasaki, C.K. Hu, Proceedings of 1996 IEEE Symposium on VLSI Technology, June 1996, p. 192.

4. R. Venkatraman, R. Marsh, E. Weitzman, B. Rogers, R. Fiordalice, M. Gall, D. Jawarani, H. Kawasaki, M. Herrick, J. Farkas, F. Pintchovski, Proceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, October 1996, in print.

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