Tailoring the internal structure of porous copper film via size-controlled copper nanosheets for electromagnetic interference shielding-Reference-Cited by-同舟云学术

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Tailoring the internal structure of porous copper film via size-controlled copper nanosheets for electromagnetic interference shielding

Published:2022-04 Issue: Volume:278 Page:115611
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Kwang Choi Ho,Bae Sukang,Lee Seoung-Ki,Hyun Lee Sang,Lee Kisu,Ko Seok-Young,Kang Jae-Wook,Yang Si-Yeong,Kim Tae-Wook

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference61 articles.

1. Electromagnetic interference shielding with 2D transition metal carbides (MXenes);Shahzad;Science,2016

2. Hierarchical porous film with layer-by-layer assembly of 2D copper nanosheets for ultimate electromagnetic interference shielding;Choi;ACS Nano,2021

3. Superhigh electromagnetic interference shielding of ultrathin aligned pristine graphene nanosheets film;Wei;Adv. Mater.,2020

4. EMI shielding: methods and materials—a review;Geetha;J. Appl. Polym. Sci.,2009

5. Polymer/carbon based composites as electromagnetic interference (EMI) shielding materials;Thomassin;Mater. Sci. Eng.: R: Rep.,2013

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1. Study on Time Dependent Growth of Single Crystalline Copper Nanosheets;Journal of Flexible and Printed Electronics;2023-12

2. One-step synthesis of low-dimensional copper-based nanomaterials with intrinsic antioxidant properties;Materials Today Communications;2023-06

3. Experimental and numerical study of different metal contacts for perovskite solar cells;Cogent Engineering;2023-03-20

4. Two-Dimensional Metal Nanostructures: From Theoretical Understanding to Experiment;Chemical Reviews;2023-02-20

5. Cognizing the electromagnetic shielding performance of ultrafine magnetite (Fe3O4) and a few layers of carbon black nanocomposite in the X-band region;Materials Science and Engineering: B;2023-02

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