Thermal degradation kinetics of poly(methylphenylsiloxane) containing methacryloyl groups
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics
Reference19 articles.
1. Effects of ambient-temperature curing agents on the thermal stability of poly(methylphenylsiloxane);Sun;Polymer Degradation and Stability,2004
2. The thermogravimetric analysis of some polysiloxanes;Jovanovic;Polymer Degradation and Stability,1998
3. Thermal degradation of polysiloxane-3. poly(dimethyl/methylphenylsiloxane);Grassie;Polymer Degradation and Stability,1980
4. New methods for evaluation of kinetic parameters and mechanism of degradation from pryolysis-GC studies: thermal degradation of polydimethylsiloxanes;Radhakrishnan;Journal of Applied Polymer Science,1999
5. Kinetics of thermal degradation and thermal oxidative degradation of poly(p-dioxanone);Yang;European Polymer Journal,2003
Cited by 79 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Curing and degradation kinetics of crosslinked epoxidized soybean oil with isosorbide-based curing agent;Journal of Environmental Chemical Engineering;2024-04
2. Curing and thermal degradation behavior of epoxy‐based vitrimers;Journal of Applied Polymer Science;2023-12-15
3. Thermal Degradation Studies of Poly(2-ethyl hexyl acrylate) in the Presence of Nematic Liquid Crystals;Polymers;2023-09-29
4. The preparation of rigid hybrid silicone resins by combining carbon nanomaterial loading nanoparticles;Polymer Composites;2022-08-08
5. Optically Transparent Multiscale Composite Films for Flexible and Wearable Electronics;Advanced Materials;2020-03-18
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3