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Phase-change materials for thermal management of electronic devices

  • Published:2022-09 Issue: Volume:214 Page:118839
  • ISSN:1359-4311
  • Container-title:Applied Thermal Engineering
  • language:en
  • Short-container-title:Applied Thermal Engineering

Author:

Bianco Vincenzo,De Rosa MattiaORCID,Vafai Kambiz

Funder

Ministero dell'Università e della Ricerca

Ministero dell'Istruzione dell'Universita e della Ricerca

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference136 articles.

1. A review on transient thermal management of electronic devices;Mathew;J. Electr. Packag.,2022

2. Brief historical perspective in thermal management and the shift toward management at the nanoscale;Smoyer;Heat Transf. Eng.,2019

3. Thermal management of on-chip hot spot;Bar-Cohen;J. Heat Transfer,2012

4. On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators;Shakouri;IEEE Trans. Compon. Packag. Technol.,2005

5. Review of metallic phase change materials for high heat flux transient thermal management applications;Shamberger;Appl. Energy,2020
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