Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package

Author:

Heo Yu Jin,Kim Hyo Tae,Kim Kyung Jun,Nahm Sahn,Yoon Young Joon,Kim Jonghee

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference20 articles.

1. Thermal effects in packaging high power light emitting diode arrays;Christensen;Applied Thermal Engineering,2009

2. Advanced thermal enhancement and management of LED packages;Weng;International Communications in Heat and Mass Transfer,2009

3. Thermal analysis and optimization of multiple LED packaging based on a general solution;Cheng;International Journal of Thermal Sciences,2010

4. Thermal measurements and analyses of low-cost high-power LED packages and their modules;Tsai;Microelectronics Reliability,2011

5. Thermal performance of high brightness LED array package on PCB;Yung;International Communications in Heat and Mass Transfer,2010

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